YOON, Y. B.; KOH, B. B.; CHO, S. An Analysis of Energy Efficiency of a Smart Envelope Package in Residential Buildings. ARCC Conference Repository, [S. l.], 2018. DOI: 10.17831/rep:arcc%y554. Disponível em: https://arcc-journal.org/index.php/repository/article/view/554. Acesso em: 18 apr. 2026.